1. Dual Detector  Employs both a semiconductor detector (no LN2 required) that has superior X-ray energy resolution and a proportional counter that has a superior coefficient rate. The semiconductor detector is especially able to distinguish between elements that have contiguous energies such as Ni and Cu, and has the following merits. 

• Ni/Cu and Au/Ni/Cu measured without a secondary filter. * In the case of a print board that contain Br, capable of high precision Au coating thickness measurements without interference from Br. * Capable of measuring ultra-thin Au films less than 0.01 µm. 

  2. Thin film FP Software  Thin Film FP Software can be used for a wide range of applications including alloy plating with lead-free solder and composite plating. 

  3. Measurement of Microscoopic Area  Round 15 µm collimator standard installed, effective for measuring coating thickness in microscopic areas. 

  4. High Power X-ray Tube  Equipped with 75 W high-powered x-ray tube. 

  5. Observation of Microscopic Areas  Can easily observe microscopic areas, equipped with four-step zoom. 

  6. Large Stage (FT9455)  Large stage enables measurement of large printed circuit boards. 

  7. Incident lighting makes samples easier to view 

  8. Collision prevention sensor makes contoured samples safe to use 

  9. High-accuracy stage drive train powered by servomotor 

  10. Accurate Focus  Measurement sample can be focused accurately by laser with one touch of the button. 

  11. Reporting Software  Report can be easily generated from measurement data with macro software.